Catalytic chemical sputtering: A novel method for obtaining large-grain polycrystalline silicon

A novel method, called the catalytic chemical sputtering method, is propose d. In this method, hydrogen atoms generated by the catalytic cracking react ion between a heated tungsten catalyzer and hydrogen gas, react with solid silicon to draw out silicon-hydride species from it chemically, and such sp ecies are again decomposed by the catalytic cracking reaction or directly t ransported to form silicon films on substrates. Thus, silicon films are pre pared at low substrate temperatures without using silane or disilane gases. By this method, polycrystalline silicon with a grain size larger than 1 mu m is obtained at substrate temperatures of approximately 400 degreesC.