Disulfide bond formation in refolding of thermophilic fungal protein disulfide isomerase

Authors
Harada, T Kurimoto, E Tokuhiro, K Asami, O Sakai, T Nohara, D Kato, K
Citation
T. Harada et al., Disulfide bond formation in refolding of thermophilic fungal protein disulfide isomerase, J BIOSCI BI, 91(6), 2001, pp. 596-598
Citations number
12
Categorie Soggetti
Biotecnology & Applied Microbiology",Microbiology
Journal title
JOURNAL OF BIOSCIENCE AND BIOENGINEERING
ISSN journal
13891723 → ACNP
Volume
91
Issue
6
Year of publication
2001
Pages
596 - 598
Database
ISI
SICI code
1389-1723(200106)91:6<596:DBFIRO>2.0.ZU;2-P
Abstract
Disulfide bond formation in the refolding of thermophilic fungal protein di sulfide isomerase (PDI) was investigated. It was revealed that (i) a disulf ide bond buried inside the molecule is preferentially formed and contribute s to the thermal stability and the isomerizing power of PDI, and (ii) forma tion of disulfide bonds in active sites located on the molecular surface ca uses deformation of the optimum conformation resulting in a decrease in the thermal stability.