Co/Cu spin valves electrodeposited on Si

Citation
L. Seligman et al., Co/Cu spin valves electrodeposited on Si, J MAGN MAGN, 226, 2001, pp. 752-753
Citations number
2
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
ISSN journal
03048853 → ACNP
Volume
226
Year of publication
2001
Part
1
Pages
752 - 753
Database
ISI
SICI code
0304-8853(200105)226:<752:CSVEOS>2.0.ZU;2-F
Abstract
Co/Cu spin-valve structures have been electrodeposited from a single bath d irectly onto n-type (1 0 0) Si substrates. The structures were based on the fact that Co layers on Si show a dependence of coercive field on layer thi ckness. By sandwiching a stack of 3, 5 or 8 hard antiferromagnetic-coupled Co/Cu multilayers between two soft Co layers, it was possible to obtain low -field-sensitive magnetoresistive structures. showing MR ratios ranging fro m 5.9% to 8.6%. as well as field sensitivities in the range of 0.10% Oe at 15-40 Oe. Samples with 8.6% MR ratio were obtained by stacking up to 10 mag netic layers. (C) 2001 Elsevier Science B.V. All rights reserved.