Scanning thermal microscopy evaluation of interface thermal property of composites for electronic packaging

Authors
Ji, Y Zhong, TX Gao, XX Luo, D Li, H Chen, HM Wang, XF Han, L
Citation
Y. Ji et al., Scanning thermal microscopy evaluation of interface thermal property of composites for electronic packaging, J TR MICROP, 19(3), 2001, pp. 365-373
Citations number
5
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences
Journal title
JOURNAL OF TRACE AND MICROPROBE TECHNIQUES
ISSN journal
07334680 → ACNP
Volume
19
Issue
3
Year of publication
2001
Pages
365 - 373
Database
ISI
SICI code
0733-4680(2001)19:3<365:STMEOI>2.0.ZU;2-K
Abstract
The metal matrix composite as a novel electronic packaging offers a high th ermal conductivity. The thermal property of interfaces of SiC/Cu, SiC/Al an d NiAl/Al composites have been comparatively evaluated by the thermal imagi ng of scanning thermal microscope (SThM) with micron-sized spatial resoluti on. The relative values of interface thermal conductivity have been obtaine d by processing and calculating SThM topographic and thermal data.