FN tunneling and hot hole (HH) stress induced leakage current (SILC) transi
ent characteristics in thin gate oxide are investigated. Under both stress
conditions, the stress induced leakage current obeys a power-law time depen
dence with different power factor. For HH SIM, the power factor significant
ly departs from -1. HH SILC is found to have a more pronounced transient ef
fect. The results show that HH SILC can be attributed to positive oxide det
rapping and annihilation of positive charge-assisted tunneling current. The
latter can be diminished by substrate hot electron injection.