Thermal energy consideration in micromagnetic simulation for laminated antiferromagnetically coupled recording media

Citation
Ch. Hee et al., Thermal energy consideration in micromagnetic simulation for laminated antiferromagnetically coupled recording media, APPL PHYS L, 79(11), 2001, pp. 1646-1648
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
79
Issue
11
Year of publication
2001
Pages
1646 - 1648
Database
ISI
SICI code
0003-6951(20010910)79:11<1646:TECIMS>2.0.ZU;2-7
Abstract
Contribution of thermal energy, has been included in the micromagnetic simu lation of laminated antiferromagnetically coupled (LAC) media. The antiferr omagnetic coupling constant, J, required to obtain M(r)t reduction in the e xisting simulation studies (T=0 K) of LAC media is much higher than the exp erimental values. In this letter, we describe some experimental results, wh ich point out that the contribution of thermal energy in M(r)t reduction is significant. Consequently, we find that the values of J and the reversal f ields are comparable to the experimental results, when thermal energy (T=30 0 K) is included in the simulation. (C) 2001 American Institute of Physics.