Ch. Hee et al., Thermal energy consideration in micromagnetic simulation for laminated antiferromagnetically coupled recording media, APPL PHYS L, 79(11), 2001, pp. 1646-1648
Contribution of thermal energy, has been included in the micromagnetic simu
lation of laminated antiferromagnetically coupled (LAC) media. The antiferr
omagnetic coupling constant, J, required to obtain M(r)t reduction in the e
xisting simulation studies (T=0 K) of LAC media is much higher than the exp
erimental values. In this letter, we describe some experimental results, wh
ich point out that the contribution of thermal energy in M(r)t reduction is
significant. Consequently, we find that the values of J and the reversal f
ields are comparable to the experimental results, when thermal energy (T=30
0 K) is included in the simulation. (C) 2001 American Institute of Physics.