Femtosecond laser pulses at 387 run were used to machine Si-on-SiO2 substra
tes for photonic band gap crystals. With 387 mil ultrashort near-UV pulses,
we obtained holes as small as 160 rim, which is smaller than one half of t
he laser wavelength with only conventional optics. Moreover, a pitch size o
f 420 nm is also obtained in Si-on-SiO2, which meets the spacing requiremen
t for today's telecommunication frequency - 1550 nm. Ultrafast laser microm
achining is fast and versatile, thus it is a powerful tool for in-situ micr
ostructure operations such as nanostructuring, repairing, and production in
dustrial applications.