Effect of lead content on vibration fracture behavior of Pb-Sn eutectic solder

Citation
Cm. Chuang et al., Effect of lead content on vibration fracture behavior of Pb-Sn eutectic solder, J MATER RES, 16(9), 2001, pp. 2644-2652
Citations number
14
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS RESEARCH
ISSN journal
08842914 → ACNP
Volume
16
Issue
9
Year of publication
2001
Pages
2644 - 2652
Database
ISI
SICI code
0884-2914(200109)16:9<2644:EOLCOV>2.0.ZU;2-5
Abstract
According to resonant vibration fatigue tests, near-eutectic and Pb-rich hy poeutectic Pb-Sn specimens have higher crack-propagation resistance. The te nsile flow stress of Pb-Sn solders that are near eutectic composition incre ases with decreasing Pb content. The solders were tested after either stabi lizing at 373 K or natural aging for 20 days, which gave similar results. T he naturally aged specimens show that the crack-propagation resistance incr eases with increasing aging time. A striated deformation was found to occur in Sn grain of the lower Pb specimen. This phenomenon is correlated with a deterioration of crack-propagation resistance.