According to resonant vibration fatigue tests, near-eutectic and Pb-rich hy
poeutectic Pb-Sn specimens have higher crack-propagation resistance. The te
nsile flow stress of Pb-Sn solders that are near eutectic composition incre
ases with decreasing Pb content. The solders were tested after either stabi
lizing at 373 K or natural aging for 20 days, which gave similar results. T
he naturally aged specimens show that the crack-propagation resistance incr
eases with increasing aging time. A striated deformation was found to occur
in Sn grain of the lower Pb specimen. This phenomenon is correlated with a
deterioration of crack-propagation resistance.