A batch fabrication process has been developed for making cantilever probes
for scanning thermal microscopy (SThM) with spatial resolution in the sub-
100 mn range. A heat transfer model was developed to optimize the thermal d
esign of the probes. Low thermal conductivity silicon dioxide and silicon n
itride were chosen for fabricating the probe tips and cantilevers, respecti
vely, in order to minimize heat loss from the sample to the probe and to im
prove temperature measurement accuracy and spatial resolution. An etch proc
ess was developed for making silicon dioxide tips with tip radius as small
as 20 mn. A thin film thermocouple junction was fabricated at the tip end w
ith a junction height that could be controlled in the range of 100-600 nm.
These thermal probes have been used extensively for thermal imaging of micr
o- and nano-electronic devices with a spatial resolution of 50 mn. This pap
er presents measurement results of the steady state and dynamic temperature
responses of the thermal probes and examines the wear characteristics of t
he probes.