C. Vahlas et al., Toward the improvement of the microstructure of chemical vapor deposited aluminum on silicon carbide, J ELCHEM SO, 148(9), 2001, pp. C583-C589
This paper presents results on the chemical vapor deposition of aluminum on
silicon carbide starting from triisobutylaluminum. The deposited films sho
w important systematic trends in surface roughness and porosity. Considerin
g literature information on, the deposition of aluminum on silicon, pretrea
tments of the deposition surface with hydrofluoric acid and/or titanium tet
rachloride have been tested. They lead to films with a smoother morphology
and stronger adhesion with the substrate than in the case of an untreated s
urface. Different heteroelements are observed at the interface under these
conditions. A short thermal activation of the nucleation process following
these pretreatments does not unambiguously improve the characteristics of t
he aluminum films. The obtained results can be considered for the modificat
ion of surface characteristics of silicon carbide particles which are used
in discontinuously reinforcement aluminum composite materials with the aim
to improve their mechanical properties and corrosion resistance as well as
their fabrication process. (C) 2001 The Electrochemical Society.