Optimized electrothermal design of integrated devices through the solutionto the non-linear 3-D heat flow equation

In this paper, an optimized electrothermal design of integrated devices thr ough the solution to the non-linear 3-D heat equation is presented. The the rmal solution has been achieved by the Kirchhoff transform and the 2-D Four ier transform. The electrothermal feedback has been implemented by calculat ing the device current at the actual channel temperature. A multiple layer structure approximating the effect of the package has been considered as sp atial domain in which the heat equation has been solved. (C) 2001 Elsevier Science Ltd. All rights reserved.