Fuzzy thermal modeling for MCM placement

This paper introduces a fuzzy analytical model for the optimal component pl acement of the power dissipating chips on a multichip module substrate. Our methodology considers multiobjective component placement based on thermal reliability as well as routing length criteria. The objective of the couple d placement methodology is to enhance the performance and reliability of th e multichip module system by obtaining an optimal cost during multichip, mo dule placement. Case studies of the coupled placement are presented. In add ition, the thermal distribution of the coupled placement results is simulat ed using the finite element method. (C) 2001 Elsevier Science Ltd. All righ ts reserved.