Laser probes for the thermal and thermomechanical characterisation of microelectronic devices

Citation
W. Claeys et al., Laser probes for the thermal and thermomechanical characterisation of microelectronic devices, MICROELEC J, 32(10-11), 2001, pp. 891-898
Citations number
13
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS JOURNAL
ISSN journal
00262692 → ACNP
Volume
32
Issue
10-11
Year of publication
2001
Pages
891 - 898
Database
ISI
SICI code
0026-2692(200110/11)32:10-11<891:LPFTTA>2.0.ZU;2-W
Abstract
This paper presents a review of some of the recent works that we have done on thermal characterisation of running electronic devices by laser probing. Both the single point probing and the surface imaging methodologies are co nsidered. Besides temperature mapping, laser point probing allows fault det ection in integrated circuits. Electronic speckle pattern interferometry an d shearography metholologies are presented, and examples of images of runni ng power devices and this relation to the underlying thermornechanical stre ss are shown. (C) 2001 Elsevier Science Ltd. All rights reserved.