Auger electron spectroscopy and low-energy electron diffraction were used t
o study the diffusion of Cu over an atomically clean Si(111) surface. It is
found that the diffusion gives rise to concentration distributions of copp
er with a sharp boundary and to the formation of the Si(111)-"5 x 5"-Cu sur
face phase. It is shown that transport of copper over the Si(111) surface o
ccurs via the solid-state spreading process. The temperature dependence of
the coefficient of Cu diffusion over the Si(111) surface was determined as
given by D-Cu = 10(4)exp(-1.9/kT) cm(2)/s. (C) 2001 MAIK "Nauka / Interperi
odica".