Advanced processing: CMP of Cu/low-k and Cu/ultralow-k layers

Authors
Wang, SM Grover, G Baker, C Chamberlain, J Yu, C
Citation
Sm. Wang et al., Advanced processing: CMP of Cu/low-k and Cu/ultralow-k layers, SOL ST TECH, 2001, pp. S9
Citations number
7
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLID STATE TECHNOLOGY
ISSN journal
0038111X → ACNP
Year of publication
2001
Supplement
S
Database
ISI
SICI code
0038-111X(200109):<S9:APCOCA>2.0.ZU;2-U
Abstract
Extensive development in integrating Cu/low-k and Cu/ultralow-k technology with a CMP module is underway to ensure a seamless transition. This study f ocuses on the mechanical stability of these layers and develops one solutio n using traditional CMP technology.