Catalytic technology offers a low-cost means of controlling PFC emissions w
ithout impacting the semiconductor-manufacturing process. Greater than 99%
destruction of C-1 to C-4 PFCs can be achieved at temperatures of 650-700 d
egreesC, while PFCs such as NF3 and SF6 can be destroyed at significantly l
ower temperatures using a novel PFC abatement catalyst. Laboratory and fiel
d studies demonstrate that the catalyst is stable, with the ability to main
tain high destruction efficiency for an extended period of time. Although s
table, the presence of SiF4 in the feed stream poisons the catalyst, necess
itating that it be scrubbed upstream of the catalyst bed. Cost of ownership
analysis indicates that a catalytic PFC abatement process can treat PFC em
issions from etch and CVD tools for $0.20-0.25/wafer.