A thermal loading device for local parameter determination at microcomponents

Local material parameters in microtechnical compounds and components can be determined by comparing experimental results with results of numerical sim ulation (parameter identification). Microscopic dimensions of the objects u nder investigation and very small deformations are typical conditions that have to be taken into account by using measurement methods with high accura cy and resolution and a loading equipment with excellent thermal and mechan ical stability. Especially for digital holography, but also for other optic al measuring methods (structured light, gray scale correlation) a loading d evice has been developed and constructed which widely avoids external error influences such as vibrations, optical discontinuities caused by thermal i nduced air turbulence, and undesirable thermal induced shifts of the compon ents of the loading device itself. These features allow the inspection of t he behaviour of microstructures under well defined thermal or thermomechani cal loading conditions.