Material properties in microsystems can significantly differ from those of
the respective bulk materials. Consequently, the measurement of material pr
operties directly on microscopic components is an important issue. A new hy
brid approach is presented which allows to measure material properties on c
omponents consisting of different materials. The method includes finite ele
ment simulation of the component deformation behavior and is demonstrated f
or CTE measurement on thin sputtered layers. Furthermore, a new tool for CT
E and Poisson ratio measurement on microscopic specimens is introduced.