Surface kinetics in copper CVD

Citation
Mlh. Ter Heerdt et al., Surface kinetics in copper CVD, CHEM VAPOR, 7(5), 2001, pp. 199-203
Citations number
32
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
CHEMICAL VAPOR DEPOSITION
ISSN journal
09481907 → ACNP
Volume
7
Issue
5
Year of publication
2001
Pages
199 - 203
Database
ISI
SICI code
0948-1907(200109)7:5<199:SKICC>2.0.ZU;2-5
Abstract
The surface kinetics of low temperature (100 degreesC < T < 150 degreesC) C VD of copper from Cu(hfac)VTMS are studied, and a novelmonorhoic model is a pplied to describe these kinetics. This model contains no reversible reacti ons and only those reactions between gas phase and surface species are allo wed. A mechanism, consisting of four reaction steps, is proposed and is fou nd to fit the experimental data well, even when the data are from experimen ts conducted at two different temperatures. The desorption of *Cu(hfac)(2) appears to be very rapid. Based on the results, a mechanism is proposed to describe literature results on a Cu(hfac)(2) CVD system.