NDI of delamination in IC packages using millimeter-waves

To detect delamination in integrated circuit (TC) packages, a millimeter-wa ve inspection system was developed. An open-ended coaxial line sensor was u sed as a source and also a receiver of the millimeter-wave signal that was transmitted into and reflected from the packages. The phase of the reflecti on coefficient was measured for inspection of the delamination. The package was scanned in two perpendicular directions on a plane parallel to the pac kage. A two-dimensional image was created by using the raw data of the mill imeter-wave measurement. The millimeter-wave image showed almost the same f eatures as that of scanning acoustic tomography, and the delamination was r eadily detected without using a coupling medium. Furthermore, a graph obtai ned by scanning the package in one direction along the center line of the p ackage showed a higher sensitivity for distinguishing the delamination, the reby showing a potential for the on-line detection of delamination in an IC package.