We have developed a novel batch-type technology for making three-dimensiona
l (3-D) millimeter-sized transformers for ultrasmall low-power (0.1 to 1 Wa
tt) applications. The technology uses the 3-D micropatterning of ferrite wa
fers by powder blasting to form the magnetic cores of the inductive devices
, and combines these cores with electrical windings made by flex-foil print
ed circuit board technology. Microfabrication and assembly of the parts can
be done in a batch process on a wafer/foil level, opening the way to furth
er size reduction of the components. We have measured the inductive and res
istive properties of our devices as a function of frequency and device geom
etry. The results clearly show the high potential of our technology for pow
er applications in which small-size is important.