T. Osaka et al., Effects of impurities on resistivity of electrodeposited high-B-s CoNiFe-based soft magnetic thin films, IEEE MAGNET, 37(4), 2001, pp. 1761-1763
Controlling the very small amount of inclusion of impurity elements by addi
tion to the plating bath of various organic additives was found to be very
effective in developing electrodeposited high-B-s CoNiFe soft magnetic thin
films with desirably high resistivity. Included impurities were suggested
to cause not only electron scattering but also decreasing grain size, both
of which led to an increase of the resistivity. Chemical state of impuritie
s was indicated to be controllable by selection of additives based on the f
unctional group for adsorption.