We propose a multistep procedure for Ge dot growth on Si (1 0 0) substrates
. This procedure includes (i) submonolayer C deposition on a Ge wetting lay
er or a Ge surface, (ii) Ge deposition at low temperature and (iii) postann
ealing after Ge and C deposition for controlling size, structure and densit
y of the Ge dots. The main effect of C on Ge wetting layer was to enhance a
structure transition of the Ge dot. Meanwhile, C on the Ge surface was fou
nd to suppress a structure modification of the Ge dots against post-anneali
ng. The structure of Ge layers deposited at low temperature was readily mod
ified upon post-annealing. By combining these procedures and optimizing exp
erimental conditions, 10 nm-sized Ge dots with a high number density in the
order of 10(11) cm(-2) were successfully grown on the Si (1 0 0) substrate
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