A new type of microbeam setup is presented allowing MeV ion projection imag
ing of large area structures using the final lens of a high energy micropro
be. Key issue of the new technology is the use of high aspect ratio high re
solution stencil masks capable of withstanding high beam power which are no
w available. While the theoretical lateral resolution limit for this setup
should allow the production of features well below 40 nm in size, the pract
ical imaging resolution demonstrated so far is at 300 nm with heavy ions an
d typical implantation fluence. Microstructure formation is possible on sub
strates which do not allow the application of surface contact masks or in s
ituations where such masks would result in sample contamination due to sput
tering. A compact sample heater provides high substrate temperatures up to
1300 degreesC during implantation for minimum damage implantation of crysta
lline samples. This setup opens a fascinating new field of applications in
materials science since many structures can be exposed simultaneously. Fast
structured implantation of stoichiometric doses of e.g. rare earth element
ions gives access to the production of new materials of high purity at dif
ferent substrate temperatures within reasonable time. (C) 2001 Elsevier Sci
ence B.V. All rights reserved.