Heat balance during plasma immersion ion implantation

Citation
D. Manova et al., Heat balance during plasma immersion ion implantation, PLASMA SOUR, 10(3), 2001, pp. 423-429
Citations number
36
Categorie Soggetti
Physics
Journal title
PLASMA SOURCES SCIENCE & TECHNOLOGY
ISSN journal
09630252 → ACNP
Volume
10
Issue
3
Year of publication
2001
Pages
423 - 429
Database
ISI
SICI code
0963-0252(200108)10:3<423:HBDPII>2.0.ZU;2-5
Abstract
The substrate temperature was measured during plasma immersion ion implanta tion (PIII) of nitrogen as a function of the pulse bias voltage and the rep etition frequency. The variation of the equilibrium frequency for temperatu res between 150 and 500 degreesC and pulse voltages between -5 and -30 kV w as investigated. Using these data, the relative dose per pulse for differen t voltages was obtained and its voltage dependence compared with different models for the plasma sheath expansion during PIII. A higher plasma density than measured for a static plasma without pulses, due to the interaction o f secondary electrons with the plasma, must be assumed. Good agreement with dose measurements of N implanted in Si was also observed. For high pulse f requencies above 1 kHz a deviation was observed, clearly showing that deple tion of the ions from the plasma during the pulses leads to reduced average plasma density at high repetition rates.