J. Diaz et al., Preparation of biaxially cube textured Ag, Cu-Au and Cu-Au-Ag films on Cu substrates for HTS coated conductor applications, SUPERCOND S, 14(8), 2001, pp. 576-582
Copper (100) cube textured tapes have been covered successfully with biaxia
lly textured thin and thick films of silver, gold and gold-silver by electr
odeposition techniques for high temperature superconductors (HTS) coated co
nductor applications. The cube texture of Cu was promoted by recrystallizat
ion after smooth cold rolling. The biaxially cube textured Ag films were ob
tained by the electro-epitaxial deposition technique using no post-depositi
on heat treatment. Intermediate gold buffer layers were prepared in order t
o increase the thermal stability of the cube-textured Ag-buffered Cu substr
ates. The as-electrodeposited Au buffer layers were polycrystalline, but af
ter an annealing treatment at high temperature the Au is absorbed by diffus
ion mechanism into the Cu tapes and a biaxially solid solution of Au-Cu(100
) is formed on the surface. Ag thin films deposited on Cu-Au substrates for
m the same biaxial cube texture as the rolled Cu tapes after recrystallizat
ion at high temperature.