The results of experimental study of boron (140 keV, 2 x 10(15) cm(-2)) dep
th profiles and electrical activation processes in silicon after irradiatio
n with 305 MeV Kr (10(12) cm(-2)) and 710 MeV Bi (10(11) and 10(12) cm(-2))
ions during post-radiation furnace annealing have been presented. It was f
ound that there is no difference in boron depth distribution in reference a
nd high-energy ion irradiated samples before the heat treatment. The effect
of 100 MeV ion irradiation reveals in the shift of boron depth distributio
n towards the depth of the material and significant decrease in electrical
activation of dopants. The difference in dynamics of boron activation in re
ference and high-energy heavy ion irradiated silicon samples is attributed
to the formation of stable defect clusters in ion track range. (C) 2001 Els
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