Wb. Ying et al., The chemical composition changes of silicon and phosphorus in the process of native oxide formation of heavily phosphorus doped silicon, APPL SURF S, 181(1-2), 2001, pp. 1-14
The chemical composition changes of silicon and phosphorus in the process o
f native oxide formation of both heavily phosphorus-doped Si(1 0 0) and pol
ycrystalline Si prepared by BF-treatment were monitored for a period of 1 y
ear, using angle dependent X-ray photoelectron spectroscopy (XPS). Right af
ter HF-treatment, significant amounts of unoxidized-P (P*) and a new chemic
al state of Si (Si*) having an unstable bond were detected in the surface r
egion of heavily P-doped Si. With decreasing depth, the concentration of P*
increased, whereas the Si* decreased. The surface segregated P* was larger
for P-doped Si(1 0 0) than for P-doped poly-Si. During the growth of nativ
e oxide, the distributions of P* and Si* in the underlying Si surface did n
ot change largely with oxide thickness. A part of P atoms also reacted with
oxygen and incorporated into Si-O-P network in the native oxide, and the a
mount of P-oxide increased with the progress of oxidation. The decomposed S
i 2p spectra of growing oxide films on both heavily P-doped Si showed that
the dominant component was not the Si4+, but Si3+ state until the oxide thi
ckness went up to over about 1.5 nm, while that for the low P-content Si wa
s Si4+, except at the very narrow interface. (C) 2001 Elsevier Science B.V.
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