Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu inthe presence of additives

The microstructures of electroless Ni-P and Ni-Cu-P deposits were investiga ted in the presence of thiourea and saccharin with AFM. The phosphorus cont ents and crystallinity of the deposits were investigated. Saccharin was fou nd to refine the nodular structure of the Ni-Cu-P deposit, while not affect ing the P% of the Ni-P and Ni-Cu-P deposits. On the other hand, thiourea wa s found to affect the P% and surface roughness of the Ni-P deposit. Thioure a does not exhibit nodular refining effect on the deposit. (C) 2001 Elsevie r Science B.V. All rights reserved.