Leaching of a copper residue, produced by selective oxidative leaching of a
nickel matte, in oxygenated sulfuric acid solution in the presence of chlo
ride ions was investigated. The leaching behaviors of copper and nickel in
the copper residue were determined. The effects of chloride addition, oxyge
n flowrate, sulfuric acid concentration, and temperature were studied as le
aching variables. Addition of chloride in small amounts into the leach slur
ry was found to enhance copper leaching from the residue. (C) 2001 Elsevier
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