Special issue on lead-free solder materials and soldering technologies - Foreword

Authors
Kang, SK Mavoori, H Chada, S Kao, CR Smith, RW
Citation
Sk. Kang et al., Special issue on lead-free solder materials and soldering technologies - Foreword, J ELEC MAT, 30(9), 2001, pp. 1049-1049
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
30
Issue
9
Year of publication
2001
Pages
1049 - 1049
Database
ISI
SICI code
0361-5235(200109)30:9<1049:SIOLSM>2.0.ZU;2-C