Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys

Citation
Z. Moser et al., Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys, J ELEC MAT, 30(9), 2001, pp. 1104-1111
Citations number
33
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
30
Issue
9
Year of publication
2001
Pages
1104 - 1111
Database
ISI
SICI code
0361-5235(200109)30:9<1104:STMOTB>2.0.ZU;2-K
Abstract
The maximum bubble pressure method has been used to measure the surface ten sion of pure Bi, surface tension and density of liquid binary Bi-Sn alloys (X-Bi = 0.2, 0.4, 0.6, and 0.8 molar fractions) at the temperature range fr om about 500 K to 1150 K. Similarly, there were investigated ternary alloys adding to the eutectic (3.8\at.%Ag-Sn) 0.03, 0.06, 0.09, and 0.12 molar fr actions of Bi. The linear dependencies of densities and surface tensions on temperature were observed and they were described by straight-line equatio n. It has been confirmed that the additions of Bi to liquid Sn and to the e utectic alloy (3.8at.%Ag-Sn) markedly reduce the surface tension. Experimen tal data of the surface tension of liquid Bi-Sn were compared with modeling based on Butler's method and a reasonable agreement was observed.