Application of an asymmetrical four point bend shear test to solder joints

Citation
O. Unal et al., Application of an asymmetrical four point bend shear test to solder joints, J ELEC MAT, 30(9), 2001, pp. 1206-1213
Citations number
17
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
30
Issue
9
Year of publication
2001
Pages
1206 - 1213
Database
ISI
SICI code
0361-5235(200109)30:9<1206:AOAAFP>2.0.ZU;2-2
Abstract
The asymmetrical four-point bend shear (AFPB) test method was used to measu re the shear strength and creep properties through the stress relaxation ex periments using three different Pb-free solder joint compositions in an ass olidified condition. Since it was difficult to shear the uniform specimens and the local bending usually occurs at the inner loading points, the notch es were introduced at the joint line to preferentially weaken this region. The stress analysis by finite element modeling showed that the straight not ches transform the parabolic shear stress distribution in the uniform speci men into a relatively uniform shear distribution along the bond line in the notched specimens. Therefore, the shear strength results from the notched specimens are expected to be much more accurate. Experiments showed that bo th the Sn-3.6Ag-1Cu (wt.%) and Sn-3.6Ag-1Cu-0.45Co joints have superior str ength and creep properties as compared to the Sn-3.5Ag joint. However, ther e was no statistical difference between the shear strength of the Sn-3.6Ag- 1Cu and Sn-3.6Ag-1Cu-0.45Co joints. Moreover, the difference between the cr eep resistance of these two types of joints was small.