Cy. Chang et al., Kinetics of decomposition of polyethylene glycol in electroplating solution by ozonation with UV radiation, J ENV ENG, 127(10), 2001, pp. 908-915
Citations number
24
Categorie Soggetti
Environment/Ecology,"Environmental Engineering & Energy
The kinetics of the ozonation of polyethylene glycol (PEG) with ultraviolet
(UV) radiation in the acid-based electroplating solution of the printed wi
ring board industry is studied. The substrate prescription of a typical ele
ctroplating solution is with pH of 0. 18-0.42, [CuSO4 . 5H(2)O] of 200 g/L,
[H2SO4] of 60 g/L, and [Cl-] of 0.03 g/L. Certainly, the discarded electro
plating solution is hard to treat with the common chemical and biological p
rocesses because of its acidic and metallic compositions. In addition, it c
ontains valuable substances suitable for recovery and reutilization. One of
the most important processes for reviving it is to remove the aged organic
additives such as PEG. A two-step reaction mechanism in terms of ozone A a
nd total organic carbon is proposed to express the reaction kinetics of PEG
ozonation with UV radiation with intensity [I-uv]. The initial concentrati
on of PEG is 30 mg/L, according to the recipe of a typical electroplating s
olution, which is equivalent to total organic carbon of 16.3 mg/L. The reac
tion rate r expressions of the concentrations of the liquid phase ozone C-A
Lb, PEG C-BLb, and intermediates C-ILb are r(A) (=dC(ALb)/dt) = -(k(Am) + k
(t)[I-uv)C-ALb (k(R1) + k(RI1)[I-uv])CALbCBLb - (k(R2) + k(RI2)[I-uv])CALbC
ILb, r(B) (=dC(BLb)/dt) = -(k(R1) + k(RI1)[I-uv])CALbCBLb, r(int) (=dC(ILb)
/dt) (k(R1) + k(RI1)[I-uv])CALbCBLb - (k(R2) + k(RI2)[I-uv])CALbCILb, with
k(Am) = 0.0036 s(-1), k(1) = 4.654 X 10(-5)s(-1)/(Wm(-2)), k(R1) = 13.525 M
(-1)s(-1), k(R2) = 0.751 M(-1)s(-1), k(RI1) = 0.683 M(-1)s(-1)/(Wm(-2)), an
d k(RI2) = 0.042 M(-1)s(-1)/(Wm(-2)). These reaction kinetic expressions ar
e useful and referable for the proper design of an ozonation system with UV
radiation for the treatment of PEG in the printed wiring board electroplat
ing solution.