Ion projection lithography: status of tool and mask developments

Citation
R. Kaesmaier et al., Ion projection lithography: status of tool and mask developments, MICROEL ENG, 57-8, 2001, pp. 145-153
Citations number
9
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
57-8
Year of publication
2001
Pages
145 - 153
Database
ISI
SICI code
0167-9317(200109)57-8:<145:IPLSOT>2.0.ZU;2-E
Abstract
As part of the European MEDEA project on ion projection lithography (IPL), the ion optical system of a process development tool (PDT-IOS) has been des igned and integrated at IMS Vienna. The ion optics system (PDT-IOS) include s in situ metrology systems. The different PDT-IOS subsystems, including in situ diagnostics and metrology, were switched on in the fourth quarter of 2000 so that detailed testing should start in the first quarter of 2001. In parallel to integration of the PDT ion optics, a test bench for a vertical vacuum wafer stage has been realized by Leica. Operation of magnetic beari ng supported stage movement has already been demonstrated. An ASML vacuum-c ompatible optical wafer alignment system has been integrated to this stage test bench system recently. In air, an X/Y alignment repeatability of less than 3 mn (3 sigma) has been shown. Parallel to the IPL tool activities, in tensive development of IPL stencil masks is ongoing at Infineon Technologie s Mask House and the Institute for Microelectronics Stuttgart with success in producing 150 and 200 mm stencil masks. An overview of the stencil mask development is provided. (C) 2001 Published by Elsevier Science B.V.