The 4 X Ion Projection Lithography (IPL), which is designed to reach sub 70
-nm feature sizes is a promising technology for the Next Generation Lithogr
aphy (NGL). An important feature of IPL is the 'pattern lock' system allowi
ng on-line control of the reduction ion image of stencil mask patterns proj
ected onto the resist coated wafer substrate. An important part of the patt
ern lock system is a 'reference plate' which is attached to the last lens e
lectrode of the ion-optical column. A process flow for the fabrication of t
his reference plate out of Si and Zerodur has been developed. This paper de
scribes the Si device manufacturing process. First results of LMS IPRO plac
ement measurements are presented and discussed. (C) 2001 Elsevier Science B
.V. All rights reserved.