Nanofabrication using hot embossing lithography and electroforming

Citation
Lj. Heyderman et al., Nanofabrication using hot embossing lithography and electroforming, MICROEL ENG, 57-8, 2001, pp. 375-380
Citations number
12
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
57-8
Year of publication
2001
Pages
375 - 380
Database
ISI
SICI code
0167-9317(200109)57-8:<375:NUHELA>2.0.ZU;2-F
Abstract
We demonstrate various nano- and microstructuring possibilities of electrof orming in combination with hot embossing lithography. Periodic structures d own to 120 nm and feature sizes < 50 mn have been replicated. Electrode dev ices were fabricated with various line widths and heights. The electrodes h ave a length of several mm, are defect-free over an area of some square mm and have a gapwidth down to 50 nm. Overplating provided a means to increase aspect ratios and decrease gapwidths. Daughter molds were fabricated by ba ckplating structures, forming a substantial supporting substrate. The repli cated stamps could be produced with nanoscale fidelity. (C) 2001 Elsevier S cience B.V. All rights reserved.