A method for reversing the polarity of a photoresist mask is presented. A s
ilicon dioxide mask formed by selective liquid phase deposition reproduces
the features defined in photoresist with submicron accuracy. The method is
demonstrated with photoresist patterns thinned to 200 nm line width with ox
ygen plasma, thus extending the applicability of plasma thinning from light
-field structures (lines and dots) to dark-field structures (trenches and h
oles). (C) 2001 Elsevier Science BY. All rights reserved.