Nanoscale patterning of self-assembled monolayers by e-beam lithography

Citation
T. Weimann et al., Nanoscale patterning of self-assembled monolayers by e-beam lithography, MICROEL ENG, 57-8, 2001, pp. 903-907
Citations number
11
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
57-8
Year of publication
2001
Pages
903 - 907
Database
ISI
SICI code
0167-9317(200109)57-8:<903:NPOSMB>2.0.ZU;2-V
Abstract
The resolution of e-beam lithography in standard resists is limited by the size of the molecules in the resist. High resolution e-beam resists therefo re should not only show a specific sensitivity to electrons but also be thi n and composed of small subunits. Self-assembled monolayers; (SAMs) fulfil these criteria because they are homogeneous, highly ordered films of amphip hilic molecules with a typical thickness of 1-2 nm and an intermolecular sp acing of 1-0.5 nm. We demonstrate that gold nanostructures can be fabricate d using aliphatic and aromatic thiol self-assembled monolayers as positive and negative electron beam resists. (C) 2001 Elsevier Science B.V. All-righ ts reserved.