A novel nanocomposite resist system was developed for sub-100 nm resolution
e-beam lithography by dispersing surface-treated silica nanoparticles in a
commercial ZEP520((R)) resist. At 4.0 wt % loading of silica nanoparticles
, the system exhibited a much higher resolution than ZEP520((R)) without sa
crificing the intrinsic high sensitivity and contrast of the starting polym
er. The first major result is that 46 nm-wide isolated lines were obtained
in the nanocomposite system, whereas comparatively 130 nm-wide lines were o
btained in ZEP520((R)) under the same experimental conditions. Moreover, it
was shown that the addition of silica nanoparticles resulted in a higher r
esistance of the nanocomposite to plasma etching with O-2 gas. The major re
solution improvement indicates that the nanocomposite is a promising candid
ate resist for sub-100 am resolution e-beam lithography. (C) 2001 Elsevier
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