Total reflection X-ray fluorescence (TXRF) using Synchrotron Radiation is l
ikely to be the most powerful nondestructive technique for the analysis of
trace metal impurities on silicon wafer surfaces. Of fundamental importance
in TXRF is the achievable sensitivity as characterized by the minimum dete
ction limit. This work describes the progress we achieved recently at the S
tanford Synchrotron Radiation Laboratory (SSRL) in minimum detection limits
for transition metals and will give an estimate of what can be achieved us
ing a third generation synchrotron radiation source such as SPEAR3. (C) 200
1 Elsevier Science B.V. All rights reserved.