A combination of linear programmed heating (LPH) and 3 keV Ar+- ion sputter
ing was used to obtain Sn sputter coefficients at room and elevated tempera
tures using a novel new method. At room temperature the determined value ag
rees well with the elemental sputter yield, Y-sn = 2.5, if sputter yield am
plification (SYA) of a submonolayer thin Sn film on a Cu(111) surface is ta
ken into account. However, at high temperature the sputter coefficient decr
eases to 1.1. This decrease can be explained if it is assumed that not all
Sn atoms are removed from the surface into the vacuum by the sputtering pro
cess, but knocked on into the bulk of the Cu matrix. At elevated temperatur
es these Sn atoms segregate back to the surface and can be sputtered once a
gain. (C) 2001 Elsevier Science B.V. All rights reserved.