Deposition rate and three-dimensional uniformity of RF plasma deposited SiOx films

Citation
D. Hegemann et al., Deposition rate and three-dimensional uniformity of RF plasma deposited SiOx films, SURF COAT, 142, 2001, pp. 849-855
Citations number
26
Categorie Soggetti
Material Science & Engineering
Journal title
SURFACE & COATINGS TECHNOLOGY
ISSN journal
02578972 → ACNP
Volume
142
Year of publication
2001
Pages
849 - 855
Database
ISI
SICI code
0257-8972(200107)142:<849:DRATUO>2.0.ZU;2-L
Abstract
The variation of power, pressure and O-2/HMDSO ratio in an RF plasma was ca rried out to examine deposition rates and to optimize SiOx film properties for the coating of polymers. The deposition rate can mainly be increased wi th monomer gas flow, whereas it is independent of pressure. Pure HMDSO plas mas reveal different internal conditions and deposition rates compared to g as mixtures of O-2 and HMDSO. Empirically obtained deposition models for th e used symmetrical plasma reactor are given. Investigations on the three-di mensional (3D) uniformity of quartz-like coatings on polycarbonate blocks w ith and without recesses were performed. The deposition rate depends on the dimensions of the 3D-formed parts when depositing in front of the RF elect rode. A higher pressure and use of power modulation can improve the coating uniformity in fissures. (C) 2001 Elsevier Science BN. All rights reserved.