Temperature dependency of cyclic deformation behavior of Cu-SiO2 single crystal

Copper single crystal with dispersed sphere SiO2 particles were cyclically deformed at the temperatures between 298 K and 673 K. Cu-SiO2 alloy showed longer life compared with pure copper irrespective of temperature and stres s amplitude. This would be due to matrix strengthening not only by dispersi on but also by development of cell structures in which the dispersed partic les behave as their nodes. At higher temperatures, occurrence of stress rel axation around the Cu/SiO2 interface lowered stress-amplitude dependency of slope (Delta epsilon/Delta logN). The observed easy nucleation of fine voi ds at the Cu/SiO2 interface seemed not to lower the fatigue strength nor sh orten the life. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.