Semiconductor packages shrink below 1 mm(2)

Authors
Morrison, DG
Citation
Dg. Morrison, Semiconductor packages shrink below 1 mm(2), ELECTR DES, 49(20), 2001, pp. 27-28
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
ELECTRONIC DESIGN
ISSN journal
00134872 → ACNP
Volume
49
Issue
20
Year of publication
2001
Pages
27 - 28
Database
ISI
SICI code
0013-4872(20011001)49:20<27:SPSB1M>2.0.ZU;2-U