We have studied the suitability of Plasma Enhanced Chemical Vapor Depositio
n (PECVD) to produce ultrasmooth silicon oxide layers ranging in thickness
from some nanometers to some 10 nm. A tight process control of the layer th
ickness, layer density and microroughness of the growing film is required.
We deposited silicon oxide on silicon wafers, float glass and superpolished
quartz substrates. In a remote plasma enhanced CVD process, we used tetrae
thylorthosilicate (TEOS, Si(OC2H5)(4)) as precursor. Films with a thickness
of some 10 nm were produced at different deposition parameters and charact
erized by in-situ soft X-ray reflectivity, hard X-ray diffraction and auger
electron spectroscopy. Best results could be found for the deposition usin
g TEOS in oxygen plasma. In case Of SiO2 layers deposited on standard glass
substrates signifcant roughness smoothing was obtained.