Advances in copper CVD for the semiconductor industry

The evolution of copper CVD is reviewed from the early efforts in metal CVD to the copper precursors and CVD processes currently under development for copper metallization in the semiconductor industry where copper is rapidly supplanting aluminum as the high speed interconnect metal of choice. Proce ssing techniques for achieving adhesion of CVD copper to diffusion barrier materials are discussed and precursors for atomic layer deposition (ALD) of copper are described. In addition, unique abatement technologies for coppe r CVD are outlined that minimize the release of volatile copper species int o the environment and enable the recycle of CVD by-products back to fresh c opper precursor.