Xw. Zhou et Hng. Wadley, Mechanisms of inert gas impact induced interlayer mixing in metal multilayers grown by sputter deposition, J APPL PHYS, 90(7), 2001, pp. 3359-3366
Control of interfacial roughness and chemical mixing is critical in nanomat
erials. For example, multilayers composed of similar to 20 Angstrom conduct
ive layer sandwiched between two similar to 50 Angstrom ferromagnetic layer
s can exhibit giant magnetoresistance (GMR). This property has caused a tre
mendous recent increase in hard disk storage capacity, and can potentially
result in a new generation of nonvolatile magnetic random access memories.
It has been established that good GMR properties can be obtained when the i
nterfacial roughness and interlayer mixing of these multilayers are low. Ho
wever, flat interfaces in nanoscale multilayers are not thermodynamically s
table, and cannot be obtained using thermal energy deposition processes suc
h as molecular-beam epitaxy. Hyperthermal energy sputter deposition techniq
ues using either plasma or ion-beam gun are able to create nonequilibrium f
lat interfaces, and have been shown to produce better GMR multilayers. In t
hese processes, however, inert gas ions or neutrals with energies between 5
0 and 200 eV can impact the growth surface. This may be a major source for
interlayer mixing. By using a molecular dynamics technique and a reduced or
der model, the composition profile across the thickness of multiply repeate
d Ni/Cu/Ni multilayers has been calculated as a function of the energy and
the relative flux of the inert gas ions or neutrals as well as the layer th
ickness. The results indicate that the 50-200 eV inert gas impact caused at
omic exchange between adjacent atomic layers near the surface. The probabil
ity of exchange increased with impact energy, but decreased with the number
of overlayers. The exchange between Ni overlayer and Cu underlayer atoms w
as much more significant than that between Cu overlayer and Ni underlayer a
toms. As a result, the Ni on Cu interfaces were much more diffuse than the
Cu on Ni interfaces, in good agreement with experiments. At very high inert
gas flux and impact energy, an increased probability for the underlying Cu
atoms to be exchanged to the surface resulted in significant Cu surface se
gregation. (C) 2001 American Institute of Physics.