Rapid crystallization of silicon films using Joule heating of metal films

Citation
T. Sameshima et al., Rapid crystallization of silicon films using Joule heating of metal films, APPL PHYS A, 73(4), 2001, pp. 419-423
Citations number
22
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
ISSN journal
09478396 → ACNP
Volume
73
Issue
4
Year of publication
2001
Pages
419 - 423
Database
ISI
SICI code
0947-8396(200110)73:4<419:RCOSFU>2.0.ZU;2-Y
Abstract
50-nm thick amorphous silicon films formed on glass substrates were crystal lized by rapid Joule heating induced by an electrical current flowing in 10 0-nm-thick Cr strips formed adjacently to 200-nm-thick SiO2 intermediate la yers. 3-mus-pulsed voltages were applied to the Cr strips. Melting of the C r strips caused a high Joule heating intensity of about 1 x 10(6) W/cm(2). Raman scattering measurements revealed complete crystallization of the sili con films at a Joule heating energy of 1.9 J/cm(2) via the SiO2 intermediat e layer. Transmission electron microscopy measurements confirmed a crystall ine grain size of 50-100 nm. 1-mum-long crystalline grain growth was also o bserved just beneath the edge of the Cr strips. The electrical conductivity increased from 10(-5) S/cm to 0.3 S/cm for 7 x 10(17)-cm(-3)-phosphorus-do ped silicon films because of activation of the phosphorus atoms because of crystallization. The numerical analysis showed a density of localized defec t states at the mid gap of 8.0 x 10(17) cm(-3). Oxygen plasma treatment at 250 degreesC and 100 W for 5 min reduced the density of the defect states t o 2.7 x 10(17) cm(-3).