N-channel double-gate metal-oxide-semiconductor field-effect transistor (MO
SFET) FinFETs with gate and fin dimensions as small as 30 nm have been fabr
icated using a new, simplified process. Short channel effects are effective
ly suppressed when the Si fin width is less than two-thirds of the gate len
gth. Drive current for typical devices is found to be above 500 muA/mum (or
1mA/mum, depending on the definition of the width of the double-gate devic
e) for V-g - V-t = V-d = 1 V. The electrical gate oxide thickness in these
devices is 21A, determined from the first FinFET capacitance-versus-voltage
characteristics obtained to date. These results indicate that the FinFET i
s a promising structure for the future manufacturing of integrated circuits
with sub-60-nm feature size, and that double-gate MOSFETs can meet interna
tional technology roadmap for semiconductors performance specifications wit
hout aggressive scaling of the gate-oxide thickness.